Process Engineering - Ag300 Cvd Area Bardi

Process Engineering - Ag300 Cvd Area
Bardi
Emilia Romagna, Bardi

OUR STORY

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society.

We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.

When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50, 000+ diverse and dedicated creators & makers of technology around the world!

Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect.

People with passion and desire to disrupt the status quo, push boundaries and drive innovation - whilst unlocking your own potential.

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way.

Our technology starts with you.

Join us and start the future!

**YOUR ROLE

The main objectives of the position are:

- Guarantee tool uptime and tool performance aligned to targets

- Ensure process robustness and stability

- Definition and management of equipment control chart

- Definition, management and training for OCAP

- Management of hold lots, tool alarms and FDC

- New tool selection, Equipment Procurement Specification definition and tool start-up

- Improve tool and process performances in term of COO, defectivity, OEE, MTBC, . . .

- Develop new processes according to device/proc. dev group requirements

**YOUR SKILLS & EXPERIENCES

- Scientific degree or Ph. D. in Physics, Material Science, Chemistry, Engineering or similar

- Plasma physics, vacuum physics

- Chemical kinetics, material science

- English Knowledge

- Scientific approach

- Strong problem solving ability

- Flexibility in priorities management

- Team work ability

- Statistical skills

**SHORT AREA INTRODUCTION**:

CVD is a vital technique in microchip fabrication that enables the creation of high-quality, uniform, and conformal thin films, The process involves the chemical reaction of gaseous precursors on a substrate surface, leading to the deposition of a thin film.

The reactions occur at high temperatures, typically in a controlled environment such as a vacuum or a low-pressure chamber.

Often, a plasma is used, providing additional energy to the gas-phase precursors, enabling chemical reactions to occur at much lower temperatures (typically 200-400°C).

This is crucial for depositing films on temperature-sensitive substrates or devices.

Joining us is also about a greater work-life balance and workplace with equal opportunities.

Dedicated Employee Resource Groups for women and LGBTQIA+, hybrid work arrangements are amongst the many DEI & Sustainability initiatives that make us a great place to evolve your career.